MediaTek Dimensity 9400 will have a die of impressive dimensions

MediaTek aims to put the spotlight entirely on the upcoming Dimensity 9400.
According to rumors, the next SoC will show with arrogance “the biggest die ever seen” in a smartphone device.

This scope will translate into the presence of over 30 billion transistorsa 32% increase compared to the 22.7 billion present in the Dimensity 9300.
MediaTek Dimensity 9400 therefore promises unparalleled innovation in the system-on-chip panorama, significantly detaching itself from its predecessor in terms of performance.

Unstoppable giant

To get a material idea, the die of the new platform reaches i 150 mm².

This measurement not only exceeds that of NVIDIA's GT 1030 graphics card, by approximately 74 mm², but is also close to more powerful PC GPU sizeslike the GTX 1650, with its 200 mm².

Of course, such a technological advance comes with costs, especially considering the adoption of the TSMC 3nm 'N3E' process for mass production of the Dimensity 9400. This could make this The most expensive SoC ever made by MediaTek for smartphones so far.

However, it seems that the investment is well paid off, as the performance should far surpass that of the previous SoC.
The adoption of such a large die brings several advantages, including a notable one enhancing the capabilities of the neural processing unit and a greater amount of available cache.

Predictions suggest a 20% improvement in performance, a potential that could allow it to compete head-on with Snapdragon 8 Gen 4 by Qualcomm.

Unusual peaks

Witnessing the introduction of a smartphone chipset with a physical size comparable to that of a desktop graphics processor is an event of extraordinary significance.

The clear advantages deriving from the adoption of a larger die are different, while as regards the disadvantages, in addition to the cost, we talk about the problems that have also emerged in the past: the overheating and a sudden increase in power consumption have always been problematic for MediaTek components. It's unclear whether the company has effectively addressed these issues by expanding the SoC die size.

Expectations are high, with estimates of scores on Geekbench 5 of 1900 in single-core and 8500 in multi-core.
As for Geekbench 6, a score of 2800/10000 points is expected, predictions that indicate how Dimensity 9400 can bring the performance of mobile devices to unprecedented levels and revolutionize the chipset market, with a greater emphasis on performance at the expense of less powerful and cheaper cores.