The software strategy presented by Stellantis also passes by new partnership with Foxconn. The company born from the merger between the FCA and PSA groups has announced that it has entered into a non-binding memorandum of understanding with the aim of creating a collaboration with the intent of designing a family of semiconductors built ad hoc to support Stellantis and third-party customers. This is the second time that the two parties have decided to join forces, given that as early as May the companies had announced the Mobile Drive joint venture.
The partnership will leverage both Foxconn’s semiconductor know-how, development capabilities and supply chain, as well as Stellantis’ expansive automotive experience and significant reach as the firm’s primary customer. The goal is to reduce the complexity of semiconductors, designing a new family built specifically to support Stellantis vehicles, and provide capability and flexibility in this increasingly important area as vehicles become more and more software-defined. “With Foxconn, we aim to create four families of chips that will cover more than 80% of our semiconductor needs, helping to significantly modernize our components, reduce complexity and simplify the supply chain. – said Carlos Tavares, CEO of Stellantis – This will also increase our ability to innovate faster and build products and services at a rapid pace ”.
Tavares’s words were joined by those of Young Liu, President and CEO of Foxconn Technology Group, who explained: “Like global leader in the technology sector, Foxconn has extensive experience in the production of semiconductors and software, two key components for the production of electric vehicles. We look forward to sharing this expertise with Stellantis, so that we can jointly address the challenges of the long-term supply chain as we continue with the expansion of the electric vehicle market“.
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